Background

A lighting manufacturer adopted a DOB (Driver-on-Board) linear solution in their LED production to improve product integration and production efficiency. However, certain components on the PCB may experience localized overheating due to improper layout or uneven heat dissipation during production, leading to decreased product performance, lower reliability, and even impacting lifespan. To address this issue, the manufacturer introduced infrared thermal imaging technology for temperature anomaly detection, aiming to accurately identify high-temperature areas on the PCB, optimize component layout, and improve product quality and production efficiency.

Solution

To ensure product quality and stability, the manufacturer implemented infrared thermal imaging for temperature anomaly detection. By precisely analyzing the temperature distribution across various components on the PCB, engineers can quickly identify hotspot areas and potential overheating risks. Using this data, they optimized the PCB component layout and improved heat dissipation design, effectively reducing failure rates and enhancing product reliability.

Benefits

• Precise Detection, Quick Issue Identification: Infrared thermal imaging provides clear temperature distribution maps, making it easy to quickly identify hotspot issues.
• Optimized Design, Enhanced Reliability: Well-optimized PCB layout and thermal management significantly reduce overheating risks, extending the lifespan of LED products.
• Reduced Defect Rate, Increased Production Efficiency: Improved heat dissipation solutions minimize defects caused by temperature anomalies, leading to higher production yield.